Trade fair highlight 01. March 2025

SemiPOL are capable of performing precise grinding and polishing of various materials (integrated circuits, semiconductor wafers, optical components and optical fibers, petrographic structures, precision metal parts, etc.) for microscopic (SEM, FIB, TEM, etc.) analysis. The target accuracy can reach micron level. It is mainly used for parallel grinding and polishing, quantitative thinning, continuous slicing and other precision applications. With more accessories and fixtures, it can make the grinding and polishing of complex and special-shaped parts easier and more convenient.
SemiPOL can monitor the amount of material removed in real time, or set the amount of material ground and achieve unattended operation. The servo drive motor can control the rotation speed and swing amplitude of the positioning head to Improve flatness and finish of grinding and polishing.